CAM-Workshop - April 26th and 27th, 2017
Innovation in Failure Analysis and Material Diagnostics of Electronics Components

June 30, 2017: New PDF files added in Download Area

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The 6th CAM-Workshop will take place in Halle (Saale), Germany 26th and 27th April 2017.

System in Package and 3D integration are among the most significant key technologies to enable further miniaturization combined with increasing integration density and functionality of electronic systems.

These concepts are related to a rapidly growing device complexity in terms of new materials, 3D designs and high density interconnects, therefore causing many new challenges for reliability, quality and manufacturing yield. As a consequence also novel approaches of failure analysis and microstructure diagnostics are required that are capable of isolating and analyzing defects with higher sensitivity as well as improved spatial and depth resolution.

For these reasons, the 6th international CAM Workshop on Failure Analysis and Material Diagnostics of Electronics Components 2017, organized by Fraunhofer CAM in cooperation with EUFANET, is particularly focused on innovation in failure analysis methods and tools for system in package and 3D integration electronic devices.

Within the workshop also first outcome of the CATRENE / EURIPIDES project Smart Analysis Methods for 3D Integration in Advanced Microsystems and Corresponding Materials (SAM3) will be presented.

Following its tradition the workshop will bring together experts from semiconductor industry and failure analysis equipment manufacturers, allowing them to discuss current and upcoming technological needs together with the latest achievements in failure analysis results, methods and instrumentation during the presentations and at the workshop’s exhibition.

Furthermore, in 2017 Fraunhofer CAM can look back to 25 years of successful research activities in Halle, Germany. On this occasion, we will take the opportunity of the CAM workshop to celebrate our 25 anniversary together with long-standing and new industry and research partners!