EXHIBITORS

Booth 1: InfraTec GmbH

Dresden based InfraTec GmbH Infrarotsensorik und Messtechnik was founded in 1991. The German company employs more than 200 employees and has its own design, manufacturing and distribution capabilities. InfraTec’s Infrared Measurement division is one of the leading suppliers of commercial thermal imaging technology. Beside high-end camera series ImageIR® and the VarioCAM® High Definition product family, the company offers turnkey thermographic automation solutions, e.g. automated Lock-in thermographic test benches for microscopic failure inspection of electronics. Smallest defects like point and line shunts, oxide failures, transistor and diode failures can be detected in 2D and 3D.

Company Name:

Address:

Website:

Contact Person:

Phone:

Email:

InfraTec GmbH

Gostritzer Str. 61-63, 01217 Dresden, Germany

www.infratec.de

Steffen Sturm

+49 351 871 8610

s.sturm(at)infratec.de

Booth 2: IONTOF GmbH

 

 

 

 

 

IONTOF is a manufacturer of innovative instruments for surface analysis with different product lines for time-of-flight secondary ion mass spectrometry (TOF-SIMS) and high-sensitivity low-energy ion scattering (LEIS). Founded as a classical spin-off of the University of Münster, IONTOF has meanwhile become the technological leader in the field of TOF-SIMS and LEIS instrumentation.

The company was founded by Prof. Alfred Benninghoven, Dr. Ewald Niehuis and Mr. Thomas Heller in 1989 to commercialise the original research carried out by Prof. Benninghoven and his team at the University of Muenster in Germany from the early 80’s.

Company Name:

Address:

Website:

Contact Person:

Phone:

Email:

IONTOF GmbH

Heisenbergstraße 15, 48149 Münster, Germany

www.iontof.com

Sven Kayser

+49 251 1622 170

sales(at)iontof.com

Booth 3: Kleindiek Nanotechnik GmbH

 

Kleindiek Nanotechnik specializes in high-end nanomanipulation systems for in situ nanoprobing, failure analysis, and other manipulation applications. The ultra-compact nanomanipulators offer a high degree of flexibility, stability, and precision. They can be equipped with various tools for in situ electrical and mechanical characterisation.

In addition, the micromanipulators are very well suited for standard tasks such as TEM lamella liftout. Intuitive software provide a number of measurement and control functions guiding the user to the required result.

Company Name:

Address:

Website:

Contact Person:

Phone:

Email:

Kleindiek Nanotechnik GmbH

Aspenhaustr. 25, 72770 Reutlingen, Germany

www.kleindiek.com

Andrew Jonathan Smith

+4971213453950

info(at)kleindiek.com

Booth 4: JIACO Instruments

JIACO Instruments Microwave-Induced-Plasma (MIP) decapsulation system is a breakthrough innovation: Automated atmospheric pressure MIP decapsulation utilizing O2-only recipes. The system has been proven for Cu, PdCu, Au, Ag bond wires and for advanced package types like 3D, SiP, WLCSP, High Tg, Chip on Board, BOAC; all without process induced damage for reliable failure analysis and quality control.

At CAM Workshop 2018 we are presenting ‘Applications of MIP Decapsulation in Device Quality Control and Failure Analysis’ at 17:30 on Wednesday 25th April.

Company Name:

Address:

Website:

Contact Person:

Phone:

Email:

JIACO Instruments

Feldmannweg 17, 2628 CT Delft, The Netherlands

www.jiaco-instruments.com

Marc McKinnon

+31 625 261 648

mark(at)jiaco-instruments.com

Booth 5: Maser Engineering B.V.

MASER Engineering is an independent engineering service provider for reliability test and failure analysis of micro-electronic components and systems. We offer advanced facilities for Integrated Device Manufacturers, Fabless and Labless IC manufacturers as well as the Original Equipment Manufacturing companies in our main lab in Enschede, The Netherlands.

Company Name:

Address:

Website:

Contact Person:

Phone:

Email:

 

MASER Engineering

Capitol 56, 7521 PL Enschede, The Netherlands

www.maser.nl

Thijs Kempers

+31 53 480 26 80

thijs.kempers(at)maser.nl

Booth 6: Allied High Tech Products

 

For over 34 years Allied High Tech Products has been the leader in mechanical sample preparation solutions for semiconductor failure analysis. A diverse product portfolio assists with sample preparation challenges from mechanical decapsulation and backside chip (through package or through silicon) access, to front side parallel delayering on both legacy and leading edge technology nodes. Please stop by to learn more about Allied’s state-of-the-art X-Prep® Precision Milling/Grinding/Polishing System, MultiPrep™ Polisher and other high precision tools to help advance your sample preparation solutions for electrical and physical failure Analysis.
Company Name:

Address:

Website:

Contact Person:

Phone:

Email:

Allied High Tech Products, Inc.

2376 E. Pacifica Place, Rancho Dominguez, California, USA

www.alliedhightech.com

Chris Richardson

+1 970 484 2288

crichardson(at)alliedhightech.com

Merken

Booth 7: SmarAct GmbH

We at SmarAct develop and produce piezo-based high-performance micro- and nanopositioners, advanced control systems and micro-tools.

Furthermore, we manufacture complete miniaturized manipulation systems, ranging from single linear axes and rotary positioners to XY tables and compact 6D manipulators. Our microscopy products, which can be applied in normal pressure as well as in vacuum conditions, are used in a wide range of industries.

Our customers benefit from our over 10 years of experience in several scientific fields. This, accompanied by the entire value-chain of development, production, distribution and a professional service, enables us to react fast to almost any of your demands.

Company Name:

Address:

Website:

Contact Person:

Phone:

Email:

SmarAct GmbH

Schütte-Lanz-Straße 9, 26135 Oldenburg, Germany

www.smaract.com

Susanne Ernzerhof

+49 441 800 879 0

ernzerhof(at)smaract.com

Booth 8: 3D-Micromac AG

3D-Micromac is the leading specialist in laser micromachining. Our team of experts develop processes, machinery and complete systems at the highest technical and technological Level.

3D-Micromac systems and services have been successfully implemented in various high-tech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology. Our target is to completely satisfy customer demands even on the most complex Projects.

3D-Micromac adheres to high-performance and future-oriented processes at high production efficiency. Our technologies have set international standards for true Innovation.

Company Name:

Address:

Website:

Contact Person:

Phone:

Email:

3D-Micromac AG

Technologie-Campus 8, 09126 Chemnitz, Germany

www.3d-micromac.com

Mandy Gebhardt

+49 371 400 430

sales(at)3d-micromac.com


Booth 9: Imina Technologies SA/point electronic GmbH

 

 

Imina Technologies SA is a Swiss manufacturer of robotic solutions for electron and optical microscopes. Its specialized nanoprobing solutions for SEM set Imina Technologies as a leader in the semiconductor test equipment market for the characterization and failure analysis for microelectronics devices. The unique motion technology of the miBot nanoprober features nanometer positioning resolution, unmatched ease of use and high mechanical stability. The nanoprobing workflow is fully managed using the Precisio software suit, accelerating the process of establishing steady electrical contacts and acquiring measurements and quantitative data on even the smallest chip technologies. You are welcome to our booth #9 to test this step by step workflow supporting you in landing probe tips on the device under test and acquiring measurement data.
Company Name:

Address:

Website:

Contact Person:

Phone:

Imina Technologies SA

EPFL Innovation Park – Bâtiment E, 1015 Lausanne, Switzerland

www.imina.ch

Karl Boche

+ 41 22 534 921 2

Booth 10: MSSCORPS CO. LTD.

 

 

 

 

Located in Hsinchu, Taiwan and founded in 2005, MSSCORPS CO., LTD. is a service lab providing material analysis, failure analysis, and FIB circuit repair/editing. As a qualified lab, we have received three certifications, ISO 9001, ISO IEC 17025, and ISO 27001:2013. With continuous investment of new cutting-edge analytic facilities, our high quality service can meet our customers’ expectation. MSSCORPS is not just solving customers’ Problems but their reliable and best R&D partner. Our service includes TEM, EDS, EELS, FIB, FIB circuit repair/editing, SEM, EMMI, InGaAs, OBIRCH, AFM, C-AFM, nanoprobe, CP, X-RAY, and Decapsulation. Please visit our web page or contact us directly for more Information.

Company Name:

Address:

Website:

Contact Person:

Phone:

Email:

MSSCORPS CO., LTD.

1F, No. 27, Pu-Ding Rd., Hsinchu, Taiwan (R.O.C)

www.msscorps.com

Shih-hsin Chang

+886 966 653 906

shih-hsin.chang(at)msscorps.com

Merken

Booth 11: Sector Technologies

SECTOR TECHNOLOGIES is a distributor Company for high-tech products within European Semiconductor Industry. Our focus is mainly the distribution of failure analysis high-end Equipment.
The acceleration of new technology introduction requires new tools for design debug, yield enhancement, customer return. Time to market is key for success and the failure analysis lab is one of the very important brick of that process.
Tools and products must be adapted to the technology challenges but methodology and knowledge are key to the results; this is why we like to say that we provide solutions to our customers.
Tools for complex packages failure analysis has become a must, specifically for non-destructive Analysis.
Lock-in Thermography (Elite), EMMI and laser scanning microscopy application (Meridian family) and nanoprobing (nProber III, Flexprober, Hyperion) from ThermoFisher; 3D Xray CT (Zeiss Xradia Versa products);Terahertz TDR (EOTPR 2000 from Teraview) are products specifically targeted for process development, yield improvement, failure analysis for complex electronics components.
Samples preparation and backside silicon thinning has also become a significant challenge; varioMill from Varioscale allows outstanding automated backside preparation on single die but also on stacked dies assembly.
We also have new products to present in the test and debug area (Mutest, Teseda, Focused Test), test analysis software (GAT), probing station (SEMICS) .
Company Name:

Address:

Website:

Contact Person:

Phone:

Email:

Sector Technologies

24 Rue Lamartine, 38320 Eybens, France

www.sector-technologies.com

Yvan Pfefer

+33 619 565 386

yvan.pfefer(at)sector-technologies.com

Booth 12: Attolight AG

Attolight manufactures market-leading, fully integrated cathodoluminescence (CL) systems for compound semiconductor characterization and failure analysis. Our CL-SEM’s nm spatial resolution and hyperspectral capability enables facile and rapid defect inspection in LEDs, MicroLEDs, Transistors (Power, RF, advanced logic), Lasers. We have a strong focus on compound semiconductor materials, the importance of these materials strongly increases in multiple market segments. One example is automotive where the increase of power density and system cost reduction of GaN based transistors is a game changer. Attolight is currently launching its first in-line full-wafer CL control tool compatible with wafers up to 300 mm.
Company Name:

Address:

Website:

Contact Person:

Phone:

Email:

Attolight AG

EPFL Innovation Park, Building D, 1015 Lausanne, Switzerland

www.attolight.com

Pierre-Yves Cattin

+41 78 638 36 12

cattin(at)attolight.com

Booth 13: John P. Kummer GmbH

 

 

The John P. Kummer GmbH is a specialist European Distributor of instruments and consumables mainly for the Semiconductor industry, but also for the Medical Device, Aerospace, Solar and related Industries.

Using our long established relationships within These industries worldwide, we bring the newest and most technologically advanced products in their fields to the European market.

At the CAM workshop we will demonstrate a laser decapsulator from Baublys, which is used to open integrated circuit packages.

Company Name:

Address:

Website:

Contact Person:

Phone:

Email:

John P. Kummer GmbH

Steinerne Furt 78, 86167 Augsburg, Germany

www.jpkummer.com

Andreas Schupp

+49 821 748720

sales_de(at)jpkummer.de

Booth 14: Hamamatsu Photonics Deutschland GmbH

 

 

 

 

 

Hamamatsu Photonics is a worldwide leading manufacturer of opto-electronic components and systems. Among others we offer sensors and systems for spectroscopy (including ultra fast), scientific-grade cameras, beam monitoring solutions, photon counting detectors and systems, photomultipliers, photodiodes, IR detectors.

Products for the CAM Workshop: Systems for failure localisation on integrated circuits based on emission microscopy (EMMI), laser based techniques (OBIRCH, OBIC, SDL, EOP) and lock-in thermography techniques (LIT).

Company Name:

Address:

Website:

Contact Person:

Phone:

Email:

Hamamatsu Photonics Deutschland GmbH

Arzbergerstr. 10, 82211 Herrsching, Germany

www.hamamatsu.de

Hubert Ortner

+49 8152 375 203

dialog(at)hamamatsu.de

Booth 15: Physical Electronics GmbH

The Physical Electronics GmbH is a stable partner for high-tech companies located in Munich, Germany, more than 21 years. Areas of our expertise are in Tapping AFM-IR, an innovative combination of 10nm high spatial resolution IR Spectrometry and AFM. Latest high-end Surface Science analysis techniques in our portfolio are the TOF-SIMS MS / MS & XPS /XAXPES (Hard x-ray photoelectron spectroscopy). Since October 2017, we are proud to offer the mIRage™ IR Microscope, which is changing the field of IR spectroscopy by achieving submicron spatial resolution and measurements of thick samples in reflection mode without the contact limitations of ATR.

Company Name:

Address:

Website:

Contact Person:

Phone:

Email:

Physical Electronics GmbH

Fraunhoferstr. 4, 85737 Ismaning, Germany

www.phi-gmbh.eu

Gundula Reitenbach

+49 89 96275 21

greitenbach(at)phi-europe.com

Booth 16: Gatan GmbH

 Gatan, Inc. is the world’s leading manufacturer of instrumentation and software used to enhance and extend the operation and performance of electron microscopes. Gatan products, which are fully compatible with nearly all electron microscope models, cover the entire range of the research process – from specimen preparation and manipulation to imaging and analysis. For more information, visit: www.gatan.com.

During the CAM-workshop Gatan will exhibit various preparation techniques for transmission electron microscopy (TEM) and scanning electron microscopy (SEM).

Company Name:

Address:

Website:

Contact Person:

Phone:

Email:

Gatan GmbH

Ingolstädter Str. 12, 80807 München, Germany

www.gatan.com

Dr. Merlin Müller

+49 30 484 75805

mmueller(at)gatan.com

Booth 17: Digit Concept

Worldwide Leader in IC DECAPSULATION equipment’s, over 25 years of experience, we provide the right tool and recipe for full or part Decapsulation, Bonding cut, Cross Sectioning, … by ACID, LASER, PLASMA, MECHANICAL with Artifact Free

  • iPanel ™ – New Release 2018
  • SESAMEACID™ – New Release 2018
  • SESAMEPLASMA™- New Release 2018
  • SESAMELASER™
  • SESAMEMECHANICAL™
  • SESAMETHERMAL™

UP-GRADE or TRADE-IN your old equipment with the last technics … with … New iPanel™ and New Options

See our last research presented at ESREF, IPFA, ISTFA

Have a fruitful CAM WorkShop 2018 with DIGIT CONCEPT and DC Engineering

Company Name:

Address:

Website:

Contact Person:

Phone:

Email:

DC Engineering SAS

15, rue Commodore Hallett, 14000 CAEN, France

www.digit-concept.com

Michael Obein

+33 231 354 354

m.obein(at)digit-concept.com

Merken

Merken

Booth 18: Catering

Booth 19: PVA TePla Analytical Systems GmbH

PVA TePla Analytical Systems designs and manufactures Scanning Acoustic Microscopes. We offer inspection systems for nondestructive testing and fast examination of volume and structural defects, voids, cracks or delaminations in different materials and devices for semiconductor industry, research and development. Our core competence is based on acoustic scanning in the 5 – 2000 MHz range. We offer fully automated handling systems as well as manual systems for laboratory. Our system offerings are designed for high throughput production environments for the failure analysis and Quality control of bonded wafers and IC packages and other materials.

Company Name:

Address:

Website:

Contact Person:

Phone:

Email:

PVA TePla Analytical Systems GmbH

Deutschordenstr. 38, 73463 Westhausen, Germany

www.pva-analyticalsystems.com

Anna Fuhrmann

+49 7363 9544 220

anna.fuhrmann(at)pvatepla.com

Booth 20: bsw TestSystems & Consulting AG

 bsw TestSystems & Consulting  AG is a test & measurement solution provider for the semiconductor, electronic and telecom industry as well as for research institutes.

Our key competence is on-wafer device characterization (network analysis, Noise-Parameter and Load-Pull Measurements etc.) in the RF/µ-wave and mm-Wave frequency domains as well as Signal Integrity applications, thermal imaging and DC/CV parameter extraction.

bsw partnered up with Microsanj, a leading supplier of thermal imaging systems based on the thermoreflectance principle.

The Microsanj NT110A is a self-contained and small footprint general purpose thermal imaging system that meets the challenges imposed by modern microelectronic and optoelectronic devices, featuring static and time-dependent full-field thermal analysis with submicron spatial resolution and 10 microsecond temporal Resolution.

Company Name:

Address:

Website:

Contact Person:

Phone:

Email:

bsw TestSystems & Consulting AG

Waldenbucher Str. 42, 71065 Sindelfingen, Germany

www.bsw-ag.com

Dr. Gabriel Loata

+49 7031 6931552

gabriel.loata(at)bsw-ag.com


CONTACT

Inken Ulrich
Fraunhofer IMWS
Walter-Huelse-Straße 1
06120 Halle
inken.ulrich@imws.fraunhofer.de
Telefon: +49 345 5589 140
Fax: +49 345 5589 101

Merken