KEYNOTES

1. Keynote

Prof. Michael G. Pecht, CALCE Center for Advanced Life Cycle Engineering (US)
Physics of Failure Approaches and their Relevance and Applicability for Reliability Investigations and Qualifications especially in real Automotive Electronics

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Abstract

The Internet of Things is not only permitting the sensing and control of numerous products and systems but enabling the collection of otherwise unattainable data. With the use of artificial intelligence methods, we can now use this data to assess the “health” (e.g. deviation or degradation) of a system from an expected normal operating condition, diagnose faults, to predict the future state of the system and forecast logistics actions, including maintenance and alternative mission profiles. There are also opportunities for AI in design for reliability and qualification testing. This presentation discusses the artificial intelligence methods, gives examples on what companies have already implemented, and presents possibilities for the future.

Bio

Prof Michael Pecht (25,000+ citations, 70+ H-Index) has a BS in Physics, an MS in Electrical Engineering and an MS and PhD in Engineering Mechanics from the University of Wisconsin. He is a Professional Engineer, an IEEE Life Fellow, an ASME Life Fellow, a PHM Society Life Fellow, an SAE Fellow and an IMAPS Fellow. He served as editor-in-chief of IEEE Access for six years, as editor-in-chief of IEEE Transactions on Reliability for nine years, and editor-in-chief of Microelectronics Reliability for sixteen years. He is currently the editor-in-chief of Circuit World. He has also served on three U.S. National Academy of Science studies, two US Congressional investigations in automotive safety, and as an expert to the U.S. FDA. He is the Director of CALCE (Center for Advanced Life Cycle Engineering) at the University of Maryland, which is funded by over 150 of the world’s leading electronics companies at more than US$6M/year. He has written more than twenty books on product reliability, development, use and supply chain management.  He has also written a series of books of the electronics industry in China, Korea, Japan and India. He has 10 patents. In 2008, he was awarded the highest reliability honor, the IEEE Reliability Society’s Lifetime Achievement Award. In 2010, he received the IEEE Exceptional Technical Achievement Award for his innovations in the area of prognostics and systems health management.  In 2015 he was awarded the IEEE Components, Packaging, and Manufacturing Award for visionary leadership in the development of physics-of-failure-based and prognostics-based approaches to electronics reliability.

2. Keynote

Manuel Gaertner ST Microelectronics (DE)
SiC Power Devices: A key enabler for the future e-MobilityMerken

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Abstract

Silicon Carbide (SiC) components have been used for many years in industrial applications and now are progressively entering the automotive segment. The first devices have been SiC diodes. As next wave now SiC MOSFETs are strongly entering the automotive domain in different applications like traction inverters, on board chargers and DCDC converters. Compared to well established Si components wide-bandgap materials are characterized by significant advantages especially considering a total cost of ownership approach. New innovative power packages, optimized for fast switching and better thermal management, are introduced to the market to exploit the full capabilities of the new semiconductor material.

Bio

Manuel Gaertner joined STMicroelectronics Munich in 1999 and is working as a Senior Team Leader and Marketing Manager for ASSP/ASIC and Power Discrete Devices. On top he is leading the strategic program Wide Bandgap materials for Automotive applications in EMEA region. Before joining STMicroelectronics he worked in Infineon Technologies as development engineer for Smart Power Products and as a research engineer in the “Fraunhofer Institut für Siliziumtechnologie” and at the university of Berlin. He published several articles (>20) on power electronics and is holding different patents (>5) and is representing ST in different positions in the APE, EEHE and ECPE.

3. Keynote

Marcel Wieland, Global Foundries (DE)
Packaging Saves the Day! 3D Scalability with Heterogeneous IntegrationMerken

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4. Keynote

Konstantin Schekothin, AAU Klagenfurt (AT)
„AI Techniques for Fault Analysis”Merken

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