Ingrid De Wolf I The 3D technology landscape: expected reliability issues, failure mechanisms and available analysis techniques
Wed I 09:20 – 10:00
After a short introduction to 3D-technology options, some expected failure mechanisms will be briefly explained. In the main part of this talk, an bird’s-eye view of available and emerging failure analysis techniques is given. The aim is to provide an overview of the main solutions that are currently available for failure analysis of 3D-technology devices, but also to indicate their limitations and raise awareness for the need for further research and development in this field.
The overview covers X-ray imaging, acoustic techniques, magnetic techniques, pulsed reflectrometry, SEM/TEM-based techniques, and optical- , thermal- and electrical technqiues in various combinations. For all techniques, a basic explanation of the principle is given with some examples and discussion.