KEYNOTES

Ingrid De Wolf I The 3D technology landscape: expected reliability issues, failure mechanisms and available analysis techniques
Wed I 09:20 – 10:00

After a short introduction to 3D-technology options, some expected failure mechanisms will be briefly explained. In the main part of this talk, an bird’s-eye view of available and emerging failure analysis techniques is given. The aim is to provide an overview of the main solutions that are currently available for failure analysis of 3D-technology devices, but also to indicate their limitations and raise awareness for the need for further research and development in this field.

The overview covers  X-ray imaging, acoustic techniques, magnetic techniques, pulsed reflectrometry, SEM/TEM-based techniques, and optical- , thermal- and electrical technqiues in various combinations. For all techniques, a basic explanation of the principle is given with some examples and discussion.

Ingrid De Wolf, IMEC (BE)

Ingrid De Wolf received the PhD in Physics from the KU Leuven, Belgium, in 1989. In the same year she joined IMEC, where she worked on microelectronics reliability, with special attention for mechanical stress analysis using micro-Raman spectroscopy and failure analysis.  From 1999 to 2014, she headed the group REMO, where research is focused on reliability, test and modelling of 3D technology, interconnect, OIO, MEMS and packaging. She (co-)authored more than 400 publications and won several best paper awards. She is distinguished member of technical staff at imec, IEEE senior member and professor at the department of Materials Engineering of the KU Leuven.

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Jörg Krinke I Failure Analysis Challenges of Multi-Chip Modules
Wed I 10:00 – 10:40

The automotive industry is using Multi-Chip Modules (MCM) for years in a large range of applications, packages, sizes and technologies. Molded Electronic Control Units (ECU), Multi-Chip Power Packages (MCPP), System in Package (SiP) devices, and last but not least Microelectromechanical Systems (MEMS) are found in nearly every car nowadays. The size of such modules varies from MEMS of less than 1mm x 1mm to ECUs of more than 10cm x 10cm, and a wide variety of packaging technologies is used. All this leads to tremendous challenges to the failure analysis engineering.

Localization and preparation of physical failures in MCMs is more complex and time consuming when compared to a single chip package failure analysis. Additional challenges emerge due to the close combination of several active components in one package. For example, classic localization techniques like PEM or OBIRCH do not work for chips in the middle of a die-stack. Another challenge is due to the diversity of the used materials inside an MCM. Preparation techniques well known from single chip components do not work for all materials in an MCM simultaneously. For SiPs even the return management of failed systems is affected. They must not be desoldered from the PCB for failure analysis.

To overcome such obstacles we are developing suitable localization and preparation methods at BOSCH and together with our partners in the framework of the publicly sponsored project SAM³.

We present case studies to share exemplarily some of the challenges and possible approaches.

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Jörg Krinke, Robert Bosch GmbH (DE)

Jörg Krinke received his Diploma in Materials Science from the Friedrich-Alexander University of Erlangen-Nürnberg in 1995. Prior to joining Robert Bosch GmbH in 2000, he worked as a research associate where his work was mainly concerned with microstructural characterization and electrical behaviour of grain boundaries in polycrystalline Si by the means of EBIC and TEM.

Since 2000, Jörg Krinke has worked as an engineer for reliability analyses of active electronic components, later becoming senior expert for reliability and technology assessment of first level packaging technologies of electronic components. Since 2015 he has been the Bosch project leader of the publicly sponsored project SAM³ (Smart Analysis Methods for 3D Integration in Advanced Microsystems and Corresponding Materials).

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