KEYNOTES

1. Keynote

Darvin Edwards – Edwards Enterprises (US)
“TSV and FOWLP Reliability and Failure Analysis Challenges”

Darvin Edwards joined Texas Instruments in 1980 with a B.S. degree in Physics from Arizona State University. His responsibilities included developing integrated test structures to evaluate chip/package interactions, improving the thermal performance of TI’s products, and leading the Dallas package modeling team for fifteen years. He wrote design rules to ensure package reliability, and helped develop such package technologies as flip-chip BGA, CSP, WCSP and TSVs. Along the way, he helped introduce HAST and standardized thermal tests. He was elected TI Fellow in 1999; he was most recently responsible for Analog Si/Pkg interactions within the Semiconductor Packaging Group before retiring in 2013. Darvin formed Edwards’ Enterprise Consulting LLC in 2014, specializing in helping companies solve package reliability and thermal problems, as well as providing training worldwide. He has served as Member at Large for the IEEE CPMT society and is currently co-chair of the Electronics Components and Technology Conference Applied Reliability committee of which he has been a member for 37 years. Darvin has authored and co-authored over 60 papers and articles in the field of IC packaging, has written two book chapters, and holds 26 US patents. He has been active with JEDEC, SRC, INEMI, and IMAPS.

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2. Keynote

Sven Beyer, Global Foundries (DE)
„Trends for non-volatile memory technology”

Sven Beyer is currently leading the Technology Development & Integration embedded non-volatile memory group, GLOBALFOUNDRIES Dresden. Sven’s group is managing the 40nm, 28nm & 22nm eNVM technology development and the introduction of these technologies into volume manufacturing. This includes cell concepts like eFlash, FeFET, eMRAM, RRAM.

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