Come and join us on a tour of the Fraunhofer labs here in Halle. The tours will give you an insight into our work and our facilities.

The tours will take place on Thursday, April 26th, from 14:20 till about 16:00 at Fraunhofer CAM, Heideallee 19, Halle.

Please note: Lab Tours are already fully booked. Registration for the tours is no longer possible. Participation is free of charge.

 Giga-SAM Dr. Sebastian Brand

Ultrasonic inspection is one of the most powerful methods in the field of non-destructive defect localization. It allows imaging through optically opaque materials for detecting local delaminations and voids with lateral resolutions in the range down to below 1 μm, depending on the applied frequency and the sample under investigation. Together with PVA TePla Analytical Systems GmbH, Fraunhofer CAM has developed an acoustic microscope set-up that covers the frequency range from 100 MHz up to 2 GHz. The system has been supplemented with an extended signal acquisition unit in order to increase signal sensitivity and image resolution but also to enable parametric imaging.

The acoustic microscope set-up provides a scan area of up to 2 mm and a defocus range of 7 mm to the allow for Rayleigh wave excitation. Acoustic microscopy inspection is performed in pulse-echo mode. The applicability of GHz-SAM for defect inspection in micro-bumps and through silicon via arrays will be demonstrated.

Key Features of the GHz-SAM:

  • Acoustic frequency 100 MHz – 2 GHz
  • „„Lateral resolution down to 0,7 μm
  • „„Excitation of surface wave modes provided
  • „„Combined time-resolved- and analog pre-processed data acquisition
  • Extremely fast high-resolution scanner with 50 nm scan Resolution
  • Superior surface- and subsurface sensitivity
 Thermal Defect Localization by Lock-in Thermography Christian Große

Lock-in-Thermography is a technique for thermally based fault isolation. High resolution direct IR imaging combined with two phase lock-in amplification allows precise defect localization down to μm resolution. Hot spots generated by electrical defects inside packaged devices cause a temperature increase at the surface of the device due to thermal conductivity. The time required for the heat flow will cause an additional time delay between the electrical stimulation of the defect at some site inside the package and the resulting thermal response at the package surface, hence affecting the phase shift.

In Cooperation with DCG Systems Fraunhofer CAM has developed a novel phase shift to frequency analysis for non-destructive 3D localization of thermal active defects within 3D packaged devices.

Key Features include:

  • „„High resolution direct IR imaging (InSb640 detector with 640x512pixel)
  • „„Real-time lock-in measurement (0-25Hz full frame, up to kHz sub frame)
  • „„Electrical stimulation up to 6kV
  • „„Local probing option
  • „„μK sensitivity (depending on measuring time)
  • „„Software option for automated frequency to phase shift measurement
  • „„Multi harmonics phase shift analysis (patent pending)
  • „„Calibration set-up for quantitative phase shift measurement
  • „„Contact-less absolute temperature mapping
  • „„LED and flash stimulation for pulse- phase thermography
 Laser based sample preparation Dr. Michael Krause

Laser-based preparation of samples for microstructure analysis enables fast, targeted, and flexible assessment to buried defects and structures. Using an ultrashort pulsed laser, microPREP can be used to ablate all kinds of semiconductors, metals, and dielectrics, or composites thereof.

The tool has been developed in very close cooperation of 3D-Micromac AG and Fraunhofer CAM and is meanwhile intensively used by customer’s word wide.

Key features include:

  • „„Ultrashort pulsed laser
  • „„Accurate positioning system
  • „„Vision und exhaust system
  • „„User friendly control software including recipes
  • „„Technology protected by several patents
  • Sophisticated workflows for improved TEM-sample prep, large area cross-sections and X-ray microscopy
 Nanoprobing and EBAC Jörg Jatzkowski

Si-based integrated circuits are used in almost all electronic equipment today. Securing the reliable functionality is a key especially for automotive electronics, safety and medical applications. Fraunhofer CAM supports manufacturers by advanced process characterization and failure analysis introducing innovative technologies, improving process steps, optimizing manufacturing yield as well as securing reliable field use of these devices. We help customers understand root causes for malfunctions in the context of electrical, thermal, mechanical or moisture treatment. Furthermore we work together with manufactures of nanoprobing and current imaging systems to improve hardware solutions and develop advanced analysis approaches and required sample preparation techniques.

Available SEM based localization methods:

  • 6-way nanoprobing system
  • precise electrical characterization of semiconductor components
  • Low dissipation power defect localization by EBAC technique using in-situ low noise current amplifier
  • High resolution imaging of pn-junctions by EBIC technique
 Micromechanical Testing Falk Naumann

The reliability properties of all components and materials used for microelectronic device packaging are affected by the mechanical and thermo-mechanical stresses occurring during fabrication and under operating conditions. Therefore precise knowledge of the material behavior is one key issue in understanding potential failure modes and in enabling reliable life time predictions.

Available characterization methods:

  • Temperature dependent micro-testing for industry-compatible pull-, shear- and cyclic testing of components and packaging or interconnection materials
  • Mechanical characterization of bonded interfaces (MCT/DCB) for lifetime estimations
  • Nano-indentation / scratch testing of materials and thin films at elevated temperatures up to 500 °C
  • Thermo-mechanical deformation / topography characterization and 3D optical deformation measurements of systems and components
  • Reliability testing of components (shaker, thermo shock, humidity and high temperature storage)
  • Thermo-physical characterization methods of packaging materials (DMA,TMA, DIL)