Program

Session 1: Introduction

Wednesday, 26.04.2017
09:00 – 09:2020 minMatthias PetzoldFraunhofer IMWS-CAM (DE)Opening
09:20 – 10:0040 minIngrid De WolfIMEC (BE) Keynote 1: The 3D technology landscape: expected reliability issues, failure mechanisms and available analysis techniques
10:00 – 10:4040 minJoerg KrinkeRobert Bosch GmbH (DE)Keynote 2: Failure Analysis Challenges of Multi-Chip Modules
10:40 – 11:0020 minKlaus PresselInfineon AG (DE)Material Understanding Combined with Failure Analysis – A prerequisite for a successful  System in Package  integration
11:00 – 11:2020 minAntonio OrozcoNeocera LLC (US)Magnetic Field Imaging in current FA landscape: 3D Fault Isolation, LIT and EOTPR techniques comparison
11:20 – 13:00Lunch BreakExhibition Opening

Session 2: Defect Localization

Wednesday, 26.04.2017
13:00 – 13:2020 minFrank AltmannFraunhofer IMWS-CAM (DE)3D thermal defect localization by time resolved temperature response signal processing
13:20 – 13:4020 minKristof J.P.  JacobsIMEC (BE)Light-Induced Capacitance Alteration for for Non-Destructive Open Failure Localization in 3-D TSV Structures
13:40 – 14:0020 minSebastian BrandFraunhofer IMWS-CAM (DE)Scanning Photoacoustic GHz-Microscopy for the Application in Microelectronics Failure Analysis and Metrology
14:00 – 14:2020 minPascal LimbeckerGlobalfoundries Inc (DE)Exploring the limits of spatial OBIRCH & LIT resolution in 28nm
14:20 – 14:4020 minGrigore MoldovanPoint electronic GmbH (DE)Electrical Failure Analysis in SEM: developments in techniques and applications
14:40 – 15:20 Coffee Break Exhibition

Session 3: Sample Preparation

Wednesday, 26.04.2017
15:20 – 15:4020 minMike Hassel ShearerGatan Inc. (US)Pico-Second Laser + Broad Argon Beam Sectioning of Advanced Package Devices
15:40 – 16:0020 minGrégory GoupilOrsay Physics-Tescan Orsay Holding (FR)Latest results on Gas Injection system for failure analysis applications
16:00 – 16:2020 minGuillaume AudoitCEA-Leti (FR)Sample preparation tricks for correlative FIB TOF-SIMS and computed X ray nanotomography
16:20 – 16:4020 minJiaqi TangJIACO Instruments B.V. (NL)Microwave Induced Plasma Decapsulation of System in Package Devices
16:40 – 17:0020 minChristian HollerithInfineon AG (DE)Circuit Edit on Package Level
17:00 – 18:15Drinks ReceptionExhibition

Session 4: Physical failure analysis

Thursday, 27.04.2017
08.30 – 08:5020 minSören HommelInfineon AG (DE)Calibrated Capacitive Imaging for Dopant type determination
08:50 – 09:1020 minMaher NafoutiUniversité de Tours (FR)Dopant imaging for wide band gap materials (SiC, GaN)
09:10 – 09:3020 minMarcin ZielinskiAttolight AG (CH)High resolution cathodoluminescence for characterization of electronic materials and devices
09:30 – 09:5020 minDerek NowakMolecular Vista (US)Chemical Imaging by Photo-induced Forces – fundamentals and applications of an emerging technology
09:50 – 10:1020 minS. H. LauSigray Inc. (US)Non Invasive Lab Tool for micron level trace element mapping & contamination analysis in FA & process control with capabilities comparable to synchrotron based microXRF
10:10 – 10:3020 minFelix KollmerIon-Tof GmbH (DE)FIB TOF-SIMS crater wall analysis and tomography
10:30 – 11:10 Coffee Break Exhibition

Session 5: Material characterization and mechanical testing

Thursday, 27.04.2017
11:10 – 11:3020 minDominique CarisettiThales Group (FR)IR transient temperature measurement and thermo reflectance mapping on GaN HEMTs in 2,5 D package
11:30 – 11:5020 minHolm GeislerGlobalfoundries Inc (DE)CPI – BABSI test with live electrical test monitoring
11:50 – 12:1020 minNorbert SöllnerInfineon AG (DE)Gas analysis in closed MEMS cavitites using confocal Micro Raman Spectroscopy
12:10 – 12:3020 minMartin HermsPVA TePla AG (DE)Polariscopy for stress measurements
12:30 – 12:5020 minAhmad KhaledIMEC (BE)Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis
12:50 – 16:00Lunch BreakExhibitionLab-Tours