Preliminary Program

Registration will be on Wednesday, 25th April, from 10 to 11 a.m.

Session 1: Introduction

Wednesday, 25.04.2018
11:00Matthias PetzoldFraunhofer IMWS-CAM (DE)Welcome
11:20Thorsten MeyerInfineon (DE)Keynote: Megatrends – Impact on Package Technologies
12:00Steffen KroehnertAmkor Technology (DE)Keynote: Advanced Packaging Technologies go Automotive – New Challenges for Reliability and Robustness
12:40Lunch BreakExhibition Opening

Session 2: Defect Localization

Wednesday, 25.04.2018
14:10Christian BoitUniversity of Technology Berlin (DE)Contactless Fault Isolation for Nanoscale Low Power Technologies in Chip and System
14:30Kristof J. P. JacobsIMEC (BE)Defect Localization in 3-D TSV Structures by Differential Light-Induced Capitance Alteration
14:50Sebastian Brand, Frank AltmannFraunhofer IMWS-CAM (DE)New Approaches for 3D LIT by Time Resolved Temperature Response Analysis
15:10Antoine ReverdySector Technologies (FR)Electro Optical Terahertz Pulse Reflectometry (EOTPR)
15:30Markus Sauter, Zhongling QianInfineon (DE)IC Defect Localization by Gated and Spectral Resolved Photo Emission
15:50Pascal LimbeckerGlobalfoundries (DE)Catching Nano-Scaled Defects with PFA – Limits of Localization Methods
16:10Coffee BreakExhibition

Session 3: Sample Preparation

Wednesday, 25.04.2018
16:50Steven RandolphThermo Fisher Scientific, Inc. (US)Combined Femtosecond Laser and Plasma DualBeam for In-situ Failure and Materials Analysis
17:10Mike Hassel ShearerGatan Inc. (US)Pico-Second Laser and Broad Argon Beam Tools for Characterization of Advanced Packages and Devices
17:30Jiaqi TangJIACO Instruments B.V. (NL)Applications of MIP Decapsulation in Device Quality Control and Failure Analysis
17:50Scott SilvermanVarioscale, Inc. (US)Extreme Backside Thinning for Laser Voltage Probing
18:10Pascal GounetSTMicroelectronics (FR)Plasma-FIB Delayering and Nanoprobing

Session 4: Physical Failure Analysis

Thursday, 26.04.2018
08:30Ingo SchulmeyerCarl ZEISS SMT (DE)3D Analysis of Advanced Logic and Memory Devices
08:50Miriam UngerAnasys Instruments, Inc. (US)Nanoscale AFM-IR Spectroscopy for Failure Analysis of Electronic Devices
09:10Christian RettigRobert Bosch GmbH (DE)Case Study D²PAK: ECU Impact Activates Additional AI Bond Wire Degradation
09:30Motoki EtoNippon Micrometal Corporation (JP)Newly Developed High Reliability Palladium Coated Cu Wire for Automotive Application
09:50Daniel GoranBruker Nano GmbH (DE)Crystal Orientation Mapping and Imaging Using On-Axis Transmission Kikuchi Diffraction (TKD) Technique in the SEM
10:10Coffee BreakExhibition

Session 5: Material Characterization and Mechanical Testing

Thursday, 26.04.2018
10:50Markku TilliOkmetic (FI)Keynote: C-SOI as a New Generation MEMS Sensor Platform, Current Status and Challenges
11:30Harald PreuInfineon (DE)Influence of Sample Preparation on Intrinsic Stress inside a Model Chip
11:50Viorel DragoiEV Group (AT)Room Temperature Oxide-Free Semiconductor Bonded Interfaces
12:10Thomas NuyttenIMEC (BE)Nanoscale Stress Measurements Using Raman Spectroscopy
12:30David Poppitz, Andreas GraffFraunhofer IMWS-CAM (DE)Nanobeam Diffraction for Residual Strain Analysis in GaN buffers and -HEMT Structures
12:50Michael HeckerGlobalfoundries (DE)BEOL Integrity Test of Crack Stop Features in 28nm Chip Designs
13:10Lunch BreakExhibition
14:20Lab Tours