Europa, Deutschland, Sachsen-Anhalt, Halle. Fraunhofer IWM, Cam. Bewertung elektronischer Systemintegration. Rasterelektronenmikroskop Zeiss Supra55VP. Bildet mittels EBSD-Technik u. a. Gefügeorientierung von Drahtkontakten ab. Sandy Klengel, Wissenschaftlerin. 23.09.2015 © 2015 Sven Döring / Agentur Focus

TECHNICAL TOPICS

The workshop will concentrate on failure analysis and material diagnostics of electronics components with a specific focus on:

  • Trends in semiconductor technologies, system integration solutions and electronics materials as well as the resulting demands on failure analysis, material diagnostics and quality assurance methods
  • New results in fault isolation, target preparation and defect analysis applications
  • Case studies of failure diagnostics work flows for innovative technologies
  • Innovation in material characterization and defect analysis methods
  • Progress in developments of new diagnostics tools and equipment solutions