TECHNICAL TOPICS

The workshop will concentrate on failure analysis and material diagnostics of electronics components with a specific focus on:

  • Trends in microelectronic 3D integration, SiP, WLP and resulting demands on material diagnostics and quality assurance
  • Innovative methods and new equipment solutions for fault isolation, target preparation and defect analysis for SiP and 3D integration
  • Recent progress in material characterization and defect analysis
  • Application studies of innovative failure diagnostics work flows for SiP and 3D