Dear colleagues,
welcome to the 13th CAM Workshop on “Failure Analysis and Material Diagnostics of Electronics Components,” taking place on 19–20 May 2026 in Halle (Saale), Germany
This year, we are pleased to highlight the APECS Pilot Line — with integrated CTR (Characterization Test Reliability) capabilities — as a European cornerstone for semiconductor innovation under the EU Chips Act.
APECS (Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems) is the novel pan-European pilot line that provides Europe with innovation capabilities in advanced packaging and heterogeneous integration of systems. By providing large companies, SMEs, start-ups, and other stakeholders with access to critical services, skills, and training to integrate and package chiplets into novel electronic components and systems, APECS plays a pivotal role in strengthening/securing Europe’s technological resilience and competitiveness. We look forward to discussing pressing challenges, tools, and the opportunities the APECS ecosystem creates for professionals and organizations worldwide.
We look forward to welcoming you to Halle in May 2026.
Kindest regards,
Frank Altmann on behalf of the CAM-Workshop committee







