Abstracts by Session

Session A: Introduction and Keynotes
Tues   09:50 – 10:30 Marcel Wieland Keynote 1: How advanced packaging can help on key challenges for emerging application

The semiconductor industry had solved most, if not all, challenges the industry had over the last decades. Moore’s law was one of the main drivers for innovation and secured high availability of product, fast time to market as well as cost savings, year over year. With the increasing complexity of design and the incredible invests in single digit technology nodes, Moore’s Law had slowed down significantly. High volume products, like Image Sensors, Graphic Cards and AI accelerators using heterogenous integration and advanced silicon packaging techniques are the frontiers helping the application to stay innovative. We will discuss, material diagnostic and failure analyses of a complex high frequency automotive sensor component and show failure mechanisms under ATV specific reliability requirements. The talk will include co-design, package technology, and manufacturing aspects of the application.

Tues  10:30 – 11:10 Prof. Michael G. Pecht Keynote 2: How Physics of Failure and Artificial Intelligence Concepts can be Used for Qualifying Electronic Compoments and Products

Today, products are changing very rapidly, customers have more choices, tremendous price pressure exists on suppliers, and there is pressure to test quickly. However, the traditional test and qualification standards have been inadequate in preventing failures. In fact, over the past 20 years, there have been an increasingly large number of electronics that have passed qualification tests but have failed in the field. The resulting costs of these failures have been in the hundreds of millions of dollars for many companies.

This talk will overview why the current qualification methods are inadequate, why the standards need to be replaced and how companies can qualify products in an accelerated manner to ensure acceptable reliability. One new approach pertains to in-situ product reliability assessment incorporating a fusion of data recognition and physics-of-failure based prognostics. Prognostics is a process of assessing the extent of deviation or degradation of a product from its expected normal operating conditions over time, to predict the future reliability of the product.

Tues  11:10 – 11:50 Klaus Pressel
Keynote 3: Progress in Failure Analysis – a Key for Reliable High-quality European Electronics
European electronics addresses -to a considerable part- automotive, aircraft, medical and industry applications. While these end user markets play a significant role for European economy, they impose specifically high challenges on quality and reliability. Meeting these challenges requires implementing innovative Physical Failure Analysis (FA) methods with improved capability and throughput into manufacturing workflows, from wafer processing to packaging and assembly. The presentation will give an overview of current FA research activities and discuss recent results. Examples include application of digitalization and artificial intelligence methods for FA methodologies (EUREKA-EURIPIDES2/PENTA project FA4.0), the impact of FA developments on reliability (ECSEL-JU project iRel40) and new FA use cases for Infineon’s industrial manufacturing (IPCEI ME results).