|Tues 09:50 – 10:30||Marcel Wieland||Keynote 1: How advanced packaging can help on key challenges for emerging application|
The semiconductor industry had solved most, if not all, challenges the industry had over the last decades. Moore’s law was one of the main drivers for innovation and secured high availability of product, fast time to market as well as cost savings, year over year. With the increasing complexity of design and the incredible invests in single digit technology nodes, Moore’s Law had slowed down significantly. High volume products, like Image Sensors, Graphic Cards and AI accelerators using heterogenous integration and advanced silicon packaging techniques are the frontiers helping the application to stay innovative. We will discuss, material diagnostic and failure analyses of a complex high frequency automotive sensor component and show failure mechanisms under ATV specific reliability requirements. The talk will include co-design, package technology, and manufacturing aspects of the application.
|Tues 10:30 – 11:10||Prof. Michael G. Pecht||Keynote 2: How Physics of Failure and Artificial Intelligence Concepts can be Used for Qualifying Electronic Compoments and Products
Today, products are changing very rapidly, customers have more choices, tremendous price pressure exists on suppliers, and there is pressure to test quickly. However, the traditional test and qualification standards have been inadequate in preventing failures. In fact, over the past 20 years, there have been an increasingly large number of electronics that have passed qualification tests but have failed in the field. The resulting costs of these failures have been in the hundreds of millions of dollars for many companies.
This talk will overview why the current qualification methods are inadequate, why the standards need to be replaced and how companies can qualify products in an accelerated manner to ensure acceptable reliability. One new approach pertains to in-situ product reliability assessment incorporating a fusion of data recognition and physics-of-failure based prognostics. Prognostics is a process of assessing the extent of deviation or degradation of a product from its expected normal operating conditions over time, to predict the future reliability of the product.
|Tues 11:10 – 11:50||Klaus Pressel
||Keynote 3: Progress in Failure Analysis – a Key for Reliable High-quality European Electronics