Prof Michael Pecht (25,000+ citations, 70+ H-Index) has a BS in Physics, an MS in Electrical Engineering and an MS and PhD in Engineering Mechanics from the University of Wisconsin. He is a Professional Engineer, an IEEE Life Fellow, an ASME Life Fellow, a PHM Society Life Fellow, an SAE Fellow and an IMAPS Fellow. He served as editor-in-chief of IEEE Access for six years, as editor-in-chief of IEEE Transactions on Reliability for nine years, and editor-in-chief of Microelectronics Reliability for sixteen years. He is currently the editor-in-chief of Circuit World. He has also served on three U.S. National Academy of Science studies, two US Congressional investigations in automotive safety, and as an expert to the U.S. FDA. He is the Director of CALCE (Center for Advanced Life Cycle Engineering) at the University of Maryland, which is funded by over 150 of the world’s leading electronics companies at more than US$6M/year. He has written more than twenty books on product reliability, development, use and supply chain management. He has also written a series of books of the electronics industry in China, Korea, Japan and India. He has 10 patents. In 2008, he was awarded the highest reliability honor, the IEEE Reliability Society’s Lifetime Achievement Award. In 2010, he received the IEEE Exceptional Technical Achievement Award for his innovations in the area of prognostics and systems health management. In 2015 he was awarded the IEEE Components, Packaging, and Manufacturing Award for visionary leadership in the development of physics-of-failure-based and prognostics-based approaches to electronics reliability.
Manuel Gaertner – ST Microelectronics (FR)
“SiC Power Devices: A key enabler for the future e-Mobility“
Silicon Carbide (SiC) components have been used for many years in industrial applications and now are progressively entering the automotive segment. The first devices have been SiC diodes. As next wave now SiC MOSFETs are strongly entering the automotive domain in different applications like traction inverters, on board chargers and DCDC converters. Compared to well established Si components wide-bandgap materials are characterized by significant advantages especially considering a total cost of ownership approach. New innovative power packages, optimized for fast switching and better thermal management, are introduced to the market to exploit the full capabilities of the new semiconductor material.
Manuel Gaertner joined STMicroelectronics Munich in 1999 and is working as a Senior Team Leader and Marketing Manager for ASSP/ASIC and Power Discrete Devices. On top he is leading the strategic program Wide Bandgap materials for Automotive applications in EMEA region. Before joining STMicroelectronics he worked in Infineon Technologies as development engineer for Smart Power Products and as a research engineer in the “Fraunhofer Institut für Siliziumtechnologie” and at the university of Berlin. He published several articles (>20) on power electronics and is holding different patents (>5) and is representing ST in different positions in the APE, EEHE and ECPE.
Marcel Wieland, Global Foundries (DE)
„Packaging Saves the Day! 3D Scalability with Heterogeneous Integration”