Marcel Wieland I GlobalFoundries (DE)
14th June 2022 I 09:50 – 10:30
Marcel Wieland I GlobalFoundries (DE)
14th June 2022 I 09:50 – 10:30
The semiconductor industry had solved most, if not all, challenges the industry had over the last decades. Moore’s law was one of the main drivers for innovation and secured high availability of product, fast time to market as well as cost savings, year over year. With the increasing complexity of design and the incredible invests in single digit technology nodes, Moore’s Law had slowed down significantly. High volume products, like Image Sensors, Graphic Cards and AI accelerators using heterogenous integration and advanced silicon packaging techniques are the frontiers helping the application to stay innovative. We will discuss, material diagnostic and failure analyses of a complex high frequency automotive sensor component and show failure mechanisms under ATV specific reliability requirements. The talk will include co-design, package technology, and manufacturing aspects of the application.
Marcel Wieland joined AMD/Globalfoundries in 1998 for package manufacturing and development. He had contributions in AMD´s lead free conversion, copper- and micro pillar fine pitch interconnect development and chip package interaction. He is active in the field of technology development for RF/mmWave and Silicon Photonics. Marcel has worked in electronics and IC package design and manufacturing for more than 25 years. Marcel holds a master’s degree in physics.
Michael Pecht I Chair Professor and Director CALCE Electronic Products and Systems Center University of Maryland (US)
14th June 2022 I 10:30 – 11:10
Today, products are changing very rapidly, customers have more choices, tremendous price pressure exists on suppliers, and there is pressure to test quickly. However, the traditional test and qualification standards have been inadequate in preventing failures. In fact, over the past 20 years, there have been an increasingly large number of electronics that have passed qualification tests but have failed in the field. The resulting costs of these failures have been in the hundreds of millions of dollars for many companies.
This talk will overview why the current qualification methods are inadequate, why the standards need to be replaced and how companies can qualify products in an accelerated manner to ensure acceptable reliability. One new approach pertains to in-situ product reliability assessment incorporating a fusion of data recognition and physics-of-failure based prognostics. Prognostics is a process of assessing the extent of deviation or degradation of a product from its expected normal operating conditions over time, to predict the future reliability of the product.
Klaus Pressel I Infineon Technologies AG Regensburg (DE)
14th June 2022 I 11:10 – 11:50