Keynotes

How advanced packaging can help on key challenges for emerging application

Marcel Wieland I GlobalFoundries (DE)

14th June 2022 I 09:50 – 10:30

Abstract

The semiconductor industry had solved most, if not all, challenges the industry had over the last decades. Moore’s law was one of the main drivers for innovation and secured high availability of product, fast time to market as well as cost savings, year over year. With the increasing complexity of design and the incredible invests in single digit technology nodes, Moore’s Law had slowed down significantly. High volume products, like Image Sensors, Graphic Cards and AI accelerators using heterogenous integration and advanced silicon packaging techniques are the frontiers helping the application to stay innovative. We will discuss, material diagnostic and failure analyses of a complex high frequency automotive sensor component and show failure mechanisms under ATV specific reliability requirements. The talk will include co-design, package technology, and manufacturing aspects of the application.

Bio

Marcel Wieland joined AMD/Globalfoundries in 1998 for package manufacturing and development. He had contributions in AMD´s lead free conversion, copper- and micro pillar fine pitch interconnect development and chip package interaction. He is active in the field of technology development for RF/mmWave and Silicon Photonics. Marcel has worked in electronics and IC package design and manufacturing for more than 25 years. Marcel holds a master’s degree in physics.

How Physics of Failure and Artificial Intelligence Concepts Can be Used for Qualifying Electronic Components and Porducts

Michael Pecht I Chair Professor and Director CALCE Electronic Products and Systems Center University of Maryland (US)

14th June 2022 I 10:30 – 11:10

Abstract

Today, products are changing very rapidly, customers have more choices, tremendous price pressure exists on suppliers, and there is pressure to test quickly. However, the traditional test and qualification standards have been inadequate in preventing failures. In fact, over the past 20 years, there have been an increasingly large number of electronics that have passed qualification tests but have failed in the field. The resulting costs of these failures have been in the hundreds of millions of dollars for many companies.

This talk will overview why the current qualification methods are inadequate, why the standards need to be replaced and how companies can qualify products in an accelerated manner to ensure acceptable reliability. One new approach pertains to in-situ product reliability assessment incorporating a fusion of data recognition and physics-of-failure based prognostics. Prognostics is a process of assessing the extent of deviation or degradation of a product from its expected normal operating conditions over time, to predict the future reliability of the product.

Bio

Prof Michael Pecht (35,000+ citations, 85+ H-Index) has a BS in Physics, an MS in Electrical Engineering and an MS and PhD in Engineering Mechanics from the University of Wisconsin. He is a Professional Engineer, an IEEE Life Fellow, an ASME Life Fellow, a PHM Society Life Fellow, an SAE Fellow and an IMAPS Fellow. He served as editor-in-chief of IEEE Access for six years, as editor-in-chief of IEEE Transactions on Reliability for nine years, and editor-in-chief of Microelectronics Reliability for sixteen years. He has also served on three U.S. National Academy of Science studies, two US Congressional investigations in  automotive safety, and as an expert to the U.S. FDA. He is the Director of CALCE (Center for Advanced Life Cycle Engineering) at the University of Maryland, which is funded by over 150 of the world’s leading electronics companies at more than US$6M/year. He is also a Chair Professor. He has written more than twenty books on product reliability, development, use and supply chain management. He has also written a series of books of the electronics industry in China, Korea, Japan and India. He has written over 700 technical articles and 11 patents. In 2008, he was awarded the highest reliability honor, the IEEE Reliability Society’s Lifetime Achievement Award. In 2010, he received the IEEE Exceptional Technical Achievement Award for his innovations in the area of prognostics and systems health management.

Progress in Failure Analysis – a key for reliable high-quality European electronics

Klaus Pressel I Infineon Technologies AG Regensburg (DE)

14th June 2022 I 11:10 – 11:50

Abstract

European electronics addresses -to a considerable part- automotive, aircraft, medical and industry applications. While these end user markets play a significant role for European economy, they impose specifically high challenges on quality and reliability. Meeting these challenges requires implementing innovative Physical Failure Analysis (FA) methods with improved capability and throughput into manufacturing workflows, from wafer processing to packaging and assembly. The presentation will give an overview of current FA research activities and discuss recent results. Examples include application of digitalization and artificial intelligence methods for FA methodologies (EUREKA-EURIPIDES2/PENTA project FA4.0), the impact of FA developments on reliability (ECSEL-JU project iRel40) and new FA use cases for Infineon’s industrial manufacturing (IPCEI ME results).

Bio

Dr. Klaus Pressel received his PhD in Physics from Stuttgart University. Following research and development on Si/SiGe-based and Wide-Bandgap semiconductor technologies at IHP Frankfurt (Oder) he joined Infineon Technologies Regensburg. Since 2001 his focus is on innovations in assembly and packaging, including SiP and HF solutions, as well as chip-package-board/system co-design. Klaus has been leading various European ECSEL-JU and EUREKA projects, currently including the largest ECSEL-JU project iRel40 and the EUREKA-EURIPIDES2/PENTA project FA4.0. Klaus represents Infineon in various international committees, e.g. SEMI, ESTC conference, Eureka EURIPIDES2/PENTA program (now Xecs), EPOSS, and supports the Heterogenous Integration Roadmap. Klaus is author/co-author of more than 200 publications and 20 patents.