Keynotes

Process & Materials Characterization for 3D Heterogenous Integration: Opportunities in Smart Metrologies, Data Analytics, & Measurement Standards

Dr. Gaurang Choksi I Intel Corporation (US)

Technology advances in electronic packaging have supported Moore’s Law and has become an enabler of product performance…

Back-side Power Delivery Network (BSPDN): Innovative scaling booster for 3D heterogeneous integration

Anne Jourdain I IMEC (BE)

In advanced CMOS technology, 2D scaling to provide power/performance gains together with area reduction is now seriously facing routing obstruction and back-end of line (BEOL) congestion…

From embedded safety dominated ECUs towards cyber secure high performance computing systems – an automotive industry’s review

Andreas Aal I Volkswagen AG (DE)

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Failure Analysis for Physical Assurance

Dr. Navid Asadi I University of Florida (US)

In this presentation we will focus on the physical inspection methods, attacks, reverse engineering techniques, and counterfeit electronics from the device to system level…

Process & Materials Characterization for 3D Heterogenous Integration: Opportunities in Smart Metrologies, Data Analytics, & Measurement Standards

Dr. Gaurang ChoksiIntel Corporation (US)

 

Abstract

Technology advances in electronic packaging have supported Moore’s Law and has become an enabler of product performance. The need for increased integration and market differentiation results in a diverse set of 2.5/3D packaging architectures requiring new materials, technologies, and manufacturing processes.

The area of high-performance heterogeneous integration will continue to require significant improvements in the collaterals required to enable time-sensitive, cost-effective technologies. This includes appropriate metrology tools and methods, and techniques for the analysis, characterization, and optimization of manufacturing and test process.

Novel sensors, data analytics and measurement standards to address feature size scaling and multi-material systems/interfaces are critical for fundamental quantification and understanding. Applications in the areas of process development, materials characterization, and performance validation, ranging across structural reliability, signal integrity, and thermal dissipation will be reviewed. New interconnect architectures such as optical co-packaging and the need for new competencies to meet future challenges will also be discussed.

Bio

Gaurang Choksi joined Intel in 1988, after receiving his PhD degree in Engineering Science & Mechanics. During his 34+ year tenure at Intel, he has contributed to various areas including structural analysis and testing, electrical and physical design and analysis of multi-chip modules, design/analysis tool development for packages/boards, and thermal technologies and solutions. The scope of his organization includes materials characterization and selection, dimensional measurements, and modeling and validation related to structural integrity, power delivery, high speed signaling, thermals and heat dissipation, and fluid flow to support the design and development of electronic packaging, assembly, and test technologies. His team also works with the supply chain to develop and deploy appropriate metrology tools and methods. The group has teams and labs in Arizona, Oregon, and Malaysia. He has served on academic and national advisory / review boards.

Back-side Power Delivery Network (BSPDN): Innovative scaling booster for 3D heterogeneous integration

Anne Jourdain I IMEC (BE)

 

Abstract

In advanced CMOS technology, 2D scaling to provide power/performance gains together with area reduction is now seriously facing routing obstruction and back-end of line (BEOL) congestion. In other words, the latest node generations struggle to keep power/performance intact while scaling feature sizes. Scaling bottleneck considerations start to shift to the System-on-Chip (SoC) infrastructure aspects, and one specific booster that is addressed here is how to enhance the power delivery within a chip. We explore the concept of nano-TSV combined with buried power rail (BPR) and its extension to backside power grids as a system innovation that can largely provide the powerperformance-area-cost (PPAC) benefits expected from technology scaling. Various Power Delivery Network (PDN) architectures are going to be discussed as industry is now picking up quickly the way to heterogeneous innovations in order to maintain the scaling roadmap for next generation ICs.

It is expected that Backside-PDN integration will bring new challenges to metrology and failure analysis.  Controlling the extreme wafer thinning process and the high precision back-to-front lithography overlay requirements challenges the current metrology techniques.  The proximity of nTSV to active devices may also result in novel requirements for reliability studies.

Bio

Anne Jourdain received her PhD degree from University Joseph Fourier of Grenoble, France, in 1998. In 1999, she joined IMEC (Interuniversity Microelectronics Center) in Leuven, Belgium, to work on (RF-) MEMS packaging solutions. In 2007, she joined the 3D Integration Research Program of IMEC to work on various wafer-to-wafer bonding and wafer thinning technologies. In 2019, she became responsible for the BSPDN integration activities within the program before taking the lead of the 3D Heterogeneous Integration team in 2022, looking at collective die-to-wafer and direct hybrid bonding technologies for 3D stacking applications.

From embedded safety dominated ECUs towards cyber secure high performance computing systems – an automotive industry’s review

Andreas Aal I Volkswagen AG (DE)

 

Abstract

TBC

Bio

TBC

Failure Analysis for Physical Assurance

Dr. Navid Asadi I University of Florida (US)

 

Abstract

In this presentation we will focus on the physical inspection methods, attacks, reverse engineering techniques, and counterfeit electronics from the device to system level. With hardware being at the heart of the communication and networking systems, it is paramount to understand it’s security and the vulnerabilities. This talk presents how advanced microscopy, failure analysis (FA) techniques combined with image analysis and machine learning can provide assurance to electronics systems and set the stage for secure microelectronics hardware.

Bio

Dr. Navid Asadi is an Assistant Professor in the ECE Department at the University of Florida. He investigates novel techniques for IC counterfeit detection and prevention, system and chip level decomposition and security assessment, anti-reverse engineering, 3D imaging, invasive and semi-invasive physical assurance, supply chain security, etc. Dr. Asadi has received NSF CAREER award and several best paper awards from IEEE International Symposium on Hardware Oriented Security and Trust (HOST) and the ASME International Symposium on Flexible Automation (ISFA). He was also winner of D.E. Crow Innovation award from University of Connecticut. He is co-founder and the program chair of the IEEE Physical Assurance and Inspection of Electronics (PAINE) Conference.