| 09:30 – 09:50 |
Prof. Dr. Erica Lilleodden / Frank Altmann |
Fraunhofer IMWS (DE) |
Welcome |
| 09:50 – 10:30 |
Marcel Wieland |
Global Foundries (DE) |
Keynote 1: How advanced packaging can help on key challenges for emerging application |
| 10:30 – 11:10 | Prof. Michael G. Pecht | University of Maryland – CALCE (US) | Keynote 2: How Physics of Failure and Artificial Intelligence Concepts can be Used for Qualifying Electronic Components and Products |
| 11:10 – 11:50 | Klaus Pressel | Infineon Technologies AG (DE) | Keynote 3: Progress in Failure Analysis – a Key for Reliable High-quality European Electronics |
Program
Tuesday, 14.06.2022
Session A: Introduction and Keynotes
| 11:50 – 13:10 | Lunch Break / Exhibtion |
Session B: Advanced Failure Analysis Techniques I
| 13:10 – 13:30 | Hong Xuenong | National Technological University Singapore (SG) | Digital IC Netlist Recognition Using Graph Neural Network |
| 13:30 – 13:50 | Jean Roux | Hamamatsu Photonics Deutschland GmbH (DE) |
Proposal for advanced devices analysis using 930nm light source and GaAs SIL |
| 13:50 – 14:10 | Neel Leslie | Thermo Fisher Scientific (US) | Advanced Techniques for Electrical Failure Analysis of Next Generation Semiconductor Devices |
| 14:10 – 14:30 | Andreas Rummel | Kleindiek Nanotechnik GmbH (DE) | SEM-based Nanoprobing on Current and Future Nodes at Low Beam Voltages |
| 14:30 – 14:50 | Jozef Vincenc Oboňa | TESCAN ORSAY HOLDING (CZ) | Correlated Laser Machining as Part of an Integrated Sample Preparation Workflow |
| 14:50 – 15:30 |
Coffee Break / Exhibtion |
Session C: Power Electronics - Packaging
| 15:30 – 16:10 | Golta Khatibi | TU Wien (AT) |
PoF based accelerated testing |
| 16:10 – 16:30 | Oliver Schilling | Infineon Technologies AG (DE) | Generation and Charcaterization of Condensation Phenomena in Power Modules |
| 16:30 – 16:50 | Jakob Willner | KAI Kompetenzzentrum Automobil- und Industrieelektronik GmbH (AT) | Development and Application of a New Weathering Setup for Investigation of Polymer Degradation in Harsh Environments |
| 16:50 – 17:10 | Nando Kaminsky | University of Bremen (DE) | Humidity Driven Degradation in Power Semiconductor Devices |
| 17:10 – 17:30 | Gerald Dallmann | SGS INSTITUT FRESENIUS GmbH (DE) | Analysis of packaging materials for power devices- some new developments |
| 17:30 – 17:50 | Elisabeth Giebel | Fraunhofer IMWS (DE) |
Investigation of Element Enrichment in Silicone Gels Used to Encapsulate Inverter Modules for Renewable Power Generation: Reliability Test vs. Field Study |
| 17:50 – 19:00 |
Drinks Reception / Exhibtion |
| 19:00 – 22:00 |
Social Program: Caribbean Night |
Wednesday, 15.06.2022
Session D: Power Electronics - New Materials
| 08:00 – 08:40 | Manuel Gaertner | STMicroelectronics N.V. (CH) |
SiC Power Devices: A Key Enabler for the Future E-Mobility |
| 08:40 – 09:00 | Francesco Iannuzzo | Aalborg University (DK) | SiC Power MOSFETs Package-Level Testing and Issues in Normal-and Abnormal-Conditions |
| 09:00 – 09:20 | Giovanni Di Nuzzo | Infineon Technologies AG (DE) | Condition Monitoring of SiC Power Modules to Support Predictive Maintenance |
| 09:20 – 09:40 | Maximilian Podsednik | KAI Kompetenzzentrum Automobil- und Industrieelektronik GmbH (AT) | Quantitative Aluminum Depth-Profile Measurements in SiC using Laser Assisted Methods |
| 09:40 – 10:00 | Bianca Boettge | Fraunhofer IMWS (DE) | Material Characterization of Cement Based Encapsulation |
| 10:00 – 10:20 | Christophe Fery | Heraeus Deutschland GmbH & Co. KG (DE) | Front Side Interconnection with Die Top System for Improved Reliability and High Temperature Performance |
| 10:20 – 11:00 |
Coffee Break / Exhibtion |
Session E: AI Applications for Failure Analysis
| 11:00 – 11:40 | Anna Safont | University of Klagenfurt (AT) / Infineon Technologies AG (DE) |
AI in Failure Analysis: Applications and Benefits |
| 11:40 – 12:00 | Jeff Gelb | Sigray Inc. (US) | High Speed 3D X-ray Imaging of Defects at Submicron Resolution in Large Electronic Components |
| 12:00 – 12:20 | Eckhard Sperschneider | X2 Technologies GmbH (DE) | Automatic-X-Ray inspection in combination with AI analysing methods |
| 12:20 – 12:40 | Sebastian Brand | Fraunhofer IMWS (DE) | Machine Learning Approaches for Assisting Data Interpretation in Failure Analysis: Enhanced Signal Analysis in Acoustic Microscopy for Defect Localization and Material Characterization |
| 12:40 – 13:00 | Matias Oscar Volman Stern | Matworks GmbH (DE) | Deep Learning-assisted microscopic acquisition of microelectronic components with integrated region-of-interest feature extraction |
| 13:00 – 13:20 | Khaled Al-Saih | University Saint Etienne (FR) | Deep Learning Denoising of SEM Images Based on Denoiseg Trained with Synthetic Images |
| 13:20 – 14:40 |
Lunch Break / Exhibtion |
Session F: Panel Discussion
Session G: Advanced Failure Analysis Techniques II
| 15:40 – 16:00 | Simon Cannonier | cyberTECHNOLOGIES GmbH (DE) | Measure, Heat & Repeat – Development of a High Resolution Metrology Tool for Thermal Warpage Measurement in Failure Analysis and Beyond |
| 16:00 – 16:20 | Grigore Moldovan | Point electronic GmbH (DE) | High-resolution EBIC with STEM: developments and applications |
| 16:20 – 16:40 | Libor Strakos |
Thermo FisherScientific Inc (CZ) | Single platform workflows for physical failure analysis for Power, Logic & Memory |
| 16:40 – 17:00 | Manuel Petersmann | KAI Kompetenzzentrum Automobil- und Industrieelektronik GmbH (AT) | Correlation of pore formation and microstructural characteristics by linking SEM and EBSD data – application to the Cu metallization of power devices |