Tuesday, 14.06.2022
Session A: Introduction and Keynotes
09:30 – 09:50
 Prof. Dr. Erica Lilleodden / Frank Altmann
Fraunhofer IMWS (DE)
09:50 – 10:30
Marcel Wieland
Global Foundries (DE)
Keynote 1: How advanced packaging can help on key challenges for emerging application
10:30 – 11:10 Prof. Michael G. Pecht University of Maryland – CALCE (US) Keynote 2: How Physics of Failure and Artificial Intelligence Concepts can be Used for Qualifying Electronic Components and Products
11:10 – 11:50 Klaus Pressel Infineon Technologies AG (DE) Keynote 3: Progress in Failure Analysis – a Key for Reliable High-quality European Electronics
11:50 – 13:10 Lunch Break / Exhibtion
Session B: Advanced Failure Analysis Techniques I
13:10 – 13:30 Hong Xuenong National Technological University Singapore (SG) Digital IC Netlist Recognition Using Graph Neural Network
13:30 – 13:50 Jean Roux Hamamatsu Photonics Deutschland GmbH (DE)
Proposal for advanced devices analysis using 930nm light source and GaAs SIL
13:50 – 14:10 Neel Leslie Thermo Fisher Scientific (US) Advanced Techniques for Electrical Failure Analysis of Next Generation Semiconductor Devices
14:10 – 14:30 Andreas Rummel Kleindiek Nanotechnik GmbH (DE) SEM-based Nanoprobing on Current and Future Nodes at Low Beam Voltages
14:30 – 14:50 Jozef Vincenc Oboňa TESCAN ORSAY HOLDING (CZ) Correlated Laser Machining as Part of an Integrated Sample Preparation Workflow
14:50 – 15:30
Coffee Break / Exhibtion
Session C: Power Electronics - Packaging
15:30 – 16:10 Golta Khatibi TU Wien (AT)
PoF based accelerated testing
16:10 – 16:30 Oliver Schilling Infineon Technologies AG (DE) Generation and Charcaterization of Condensation Phenomena in Power Modules
16:30 – 16:50 Jakob Willner KAI Kompetenzzentrum Automobil- und Industrieelektronik GmbH (AT) Development and Application of a New Weathering Setup for Investigation of Polymer Degradation in Harsh Environments
16:50 – 17:10 Nando Kaminsky University of Bremen (DE) Humidity Driven Degradation in Power Semiconductor Devices
17:10 – 17:30 Gerald Dallmann SGS INSTITUT FRESENIUS GmbH (DE) Analysis of packaging materials for power devices- some new developments
17:30 – 17:50 Elisabeth Giebel Fraunhofer IMWS (DE)
Investigation of Element Enrichment in Silicone Gels Used to Encapsulate Inverter Modules for Renewable Power Generation: Reliability Test vs. Field Study
17:50 – 19:00
Drinks Reception / Exhibtion
19:00 – 22:00
Social Program: Caribbean Night
Wednesday, 15.06.2022
Session D: Power Electronics - New Materials
08:00 – 08:40 Manuel Gaertner STMicroelectronics N.V. (CH)
SiC Power Devices: A Key Enabler for the Future E-Mobility
08:40 – 09:00 Francesco Iannuzzo Aalborg University (DK) SiC Power MOSFETs Package-Level Testing and Issues in Normal-and Abnormal-Conditions
09:00 – 09:20 Giovanni Di Nuzzo Infineon Technologies AG (DE) Condition Monitoring of SiC Power Modules to Support Predictive Maintenance
09:20 – 09:40 Maximilian Podsednik KAI Kompetenzzentrum Automobil- und Industrieelektronik GmbH (AT) Quantitative Aluminum Depth-Profile Measurements in SiC using Laser Assisted Methods
09:40 – 10:00 Bianca Boettge Fraunhofer IMWS (DE) Material Characterization of Cement Based Encapsulation
10:00 – 10:20 Christophe Fery Heraeus Deutschland GmbH & Co. KG (DE) Front Side Interconnection with Die Top System for Improved Reliability and High Temperature Performance
10:20 – 11:00
Coffee Break / Exhibtion
Session E: AI Applications for Failure Analysis
13:20 – 14:40
Lunch Break / Exhibtion
Session F: Panel Discussion
Session G: Advanced Failure Analysis Techniques II
15:40 – 16:00 Simon Cannonier cyberTECHNOLOGIES GmbH (DE) Measure, Heat & Repeat – Development of a High Resolution Metrology Tool for Thermal Warpage Measurement in Failure Analysis and Beyond
16:00 – 16:20 Grigore Moldovan Point electronic GmbH (DE) High-resolution EBIC with STEM: developments and applications
16:20 – 16:40 Libor Strakos
Thermo FisherScientific Inc (CZ) Single platform workflows for physical failure analysis for Power, Logic & Memory
16:40 – 17:00 Manuel Petersmann KAI Kompetenzzentrum Automobil- und Industrieelektronik GmbH (AT) Correlation of pore formation and microstructural characteristics by linking SEM and EBSD data – application to the Cu metallization of power devices