Program

Tuesday, 25.04.2023
Session A: Welcome and Keynotes
09:00 – 09:20 Prof. Dr. Erica Lilleodden /  Frank Altmann
Fraunhofer IMWS (DE)
Welcome
09:20 – 10:00 Dr. Gaurang Choksi Intel Corporation (US) Keynote 1: Process & Materials Characterization for 3D Heterogenous Integration: Opportunities in Smart Metrologies, Data Analytics, & Measurement Standards
10:00 – 10:40 Anne Jourdain IMEC (BE) Keynote 2: Back-side Power Delivery Network (BSPDN): Innovative scaling booster for 3D heterogeneous integration
Session B: Advanced 3D Packaging
12:20 – 13:40 Lunch Break / Exhibtion
Session C: Novel Failure Analysis Techniques
13:40 – 14:20 Fabian Rudau Robert Bosch GmbH (DE) In Depth Logic Analysis on Digital Designs
14:20 – 14:40 Pascal Gounet STMicroelectronics (FR) Compatibility of PFIB delayering and nanoprobing for advanced technologies
14:40 – 15:00 Christian Hollerith Infineon Technologies AG (DE) Industrial Standards for Integrated Workflows within FA4.0
15:00 – 15:20 Dustin Kendig Microsanj LLC (US) Thermal and Failure Analysis of Advanced Sub-Micron Devices
15:20 – 15:40 Miriam Unger Photothermal Spectroscopy Corporation GmbH (DE) Non-contact sub-micron simultaneous Infrared+Raman microspectroscopy for failure analysis of semiconductor devices
15:40 – 16:00 Rik Otte NXP Semiconductors (NL) Physical Failure Analysis using Aberration-Corrected S/TEM
16:00 – 16:40
Coffee Break / Exhibtion
Session D: Panel Discussion - Failure Analysis Road Map
16:40 – 16:55 William Lo NVIDIA (US) Die-Level Roadmap Council (DLRC): Isolation Domain
16:55 – 17:10 Eckhard Langer Globalfoundries (DE) Die-Level Roadmap Council (DLRC): Post-Isolation Domain
17:10 – 17:25 Yan Li Intel Corporation (US) Package Innovation Roadmap Council (PIRC)
17:25 – 17:40 Nicholas Antoniou Prime Nano Inc. (US) EDFAS FA Future Roadmap Council Report
17:40 – 18:30
Drinks Reception / Exhibtion
19:00 – 22:00
Networking Dinner
Wednesday, 26.04.2023
Session E: Automotive Electronics - Tutorial
08:45 – 10:00 Peter Jacob EM Microelectronic Marin (CH) Early life failures in automotive electronic
10:00 – 10:40
Coffee Break / Exhibtion
Session F: Automotive Electronics
13:00 – 14:20
Lunch Break / Exhibtion
Session G: Hardware Security & Counterfeiting
14:20 – 15:00 Prof. Dr. Navid Asidi University of Florida (US) Keynote 4: Failure Analysis for Physical Assurance
15:00 – 15:20 Samuel Chef Nanyang Technological University (SG) Leveraging on FA tools for the recovery of embedded memory data
15:20 – 15:40 Jean Pierre Seifert TU Berlin (DE) No Need for Reverse Engineering – Machine Learning Will Do It for Us
15:40 – 16:00 Jörg Jatzkowski Fraunhofer IMWS (DE) E-Beam Probing to attac sub 20nm nodes
16:00 – 16:20 Neel Leslie  Thermo Fisher Scientific (US) Overcoming hardware attacks with Meridian E: a new approach for nondestructive security validation
16:20 – 16:40 Stephan Nickell Zeiss MultiSEM GmbH (DE) High-Throughput Imaging of Semiconductors and Electronic Components by Multi-beam SEM