| 09:00 – 09:20 | Prof. Dr. Erica Lilleodden / Frank Altmann |
Fraunhofer IMWS (DE) |
Welcome |
| 09:20 – 10:00 | Dr. Gaurang Choksi | Intel Corporation (US) | Keynote 1: Process & Materials Characterization for 3D Heterogenous Integration: Opportunities in Smart Metrologies, Data Analytics, & Measurement Standards |
| 10:00 – 10:40 | Anne Jourdain | IMEC (BE) | Keynote 2: Back-side Power Delivery Network (BSPDN): Innovative scaling booster for 3D heterogeneous integration |
Program
Tuesday, 25.04.2023
Session A: Welcome and Keynotes
Session B: Advanced 3D Packaging
| 10:40 – 11:00 | Viorel Dragoi | EV Group E. Thallner GmbH (AT) | Hybrid wafer bonding for 3D integration: promises and challenges |
| 11:00 – 11:20 | Kristof Jacobs | IMEC (BE) |
Failure Analysis Approaches for Test Structures Targeting Wafer-to-Wafer Hybrid Bonding and Backside Power Delivery Development |
| 11:20 – 11:40 | William Lo | NVIDIA (US) | X-Ray Device Alteration Using A Scanning X-Ray Microscope |
| 11:40 – 12:00 | Sebastian Brand | Fraunhofer IMWS (DE) | Advances in high-resolution nondestructive defect localization based on recent developments in signal processing |
| 12:00 – 12:20 | Harald Gossner | Intel Corporation (DE) | ESD Targets and Test Methods for High Density Die-to-Die Interfaces |
| 12:20 – 13:40 | Lunch Break / Exhibtion |
Session C: Novel Failure Analysis Techniques
| 13:40 – 14:20 | Fabian Rudau | Robert Bosch GmbH (DE) | In Depth Logic Analysis on Digital Designs |
| 14:20 – 14:40 | Pascal Gounet | STMicroelectronics (FR) | Compatibility of PFIB delayering and nanoprobing for advanced technologies |
| 14:40 – 15:00 | Christian Hollerith | Infineon Technologies AG (DE) | Industrial Standards for Integrated Workflows within FA4.0 |
| 15:00 – 15:20 | Dustin Kendig | Microsanj LLC (US) | Thermal and Failure Analysis of Advanced Sub-Micron Devices |
| 15:20 – 15:40 | Miriam Unger | Photothermal Spectroscopy Corporation GmbH (DE) | Non-contact sub-micron simultaneous Infrared+Raman microspectroscopy for failure analysis of semiconductor devices |
| 15:40 – 16:00 | Rik Otte | NXP Semiconductors (BE) | Physical Failure Analysis using Aberration-Corrected S/TEM |
| 16:00 – 16:40 |
Coffee Break / Exhibtion |
Session D: Panel Discussion - Failure Analysis Road Map
| 16:40 – 16:55 | William Lo | NVIDIA (US) | Die-Level Roadmap Council (DLRC): Isolation Domain |
| 16:55 – 17:10 | Eckhard Langer | Globalfoundries (DE) | Die-Level Roadmap Council (DLRC): Post-Isolation Domain |
| 17:10 – 17:25 | Yan Li | Intel Corporation (US) | Package Innovation Roadmap Council (PIRC) |
| 17:25 – 17:40 | Nicholas Antoniou | Prime Nano Inc. (US) | EDFAS FA Future Roadmap Council Report |
| 17:40 – 18:30 |
Drinks Reception / Exhibtion |
| 19:00 – 22:00 |
Networking Dinner |
Wednesday, 26.04.2023
Session E: Automotive Electronics - Tutorial
| 08:45 – 10:00 | Peter Jacob | EM Microelectronic Marin (CH) | Early life failures in automotive electronic |
| 10:00 – 10:40 |
Coffee Break / Exhibtion |
Session F: Automotive Electronics
| 10:40 – 11:20 | Andreas Aal | Volkswagen AG (DE) | Keynote 3: From embedded safety dominated ECUs towards cyber secure high performance computing systems – an automotive industry’s review |
| 11:20 – 11:40 | Oliver Senftleben | BMW AG (DE) | Reliability as a key Challenge for future Vehicle Architectures |
| 11:40 – 12:00 | Davina Nienhues | Robert Bosch GmbH (DE) | Corrosion on Semiconductor Surfaces – Determination of Ionic Contamination Limits |
| 12:00 – 12:20 | Robert Klengel | Fraunhofer IMWS (DE) | Comprehensive Study of Long-Term Reliability of Copper Bonding Wires at Harsh Automotive Conditions |
| 12:20 – 12:40 | Horst Theuss | Infineon Technologies AG (DE) | Packaging of MEMS and Sensors |
| 12:40 – 13:00 | Heiko Stegmann | Carl Zeiss Microscopy GmbH (DE) | Characterization of power semiconductor junctions by combining three-dimensional FIB-SEM imaging and EBIC |
| 13:00 – 14:20 |
Lunch Break / Exhibtion |
Session G: Hardware Security & Counterfeiting
| 14:20 – 15:00 | Prof. Dr. Navid Asidi | University of Florida (US) | Keynote 4: Failure Analysis for Physical Assurance |
| 15:00 – 15:20 | Samuel Chef | Nanyang Technological University (SG) | Leveraging on FA tools for the recovery of embedded memory data |
| 15:20 – 15:40 | Jean Pierre Seifert | TU Berlin (DE) | No Need for Reverse Engineering – Machine Learning Will Do It for Us |
| 15:40 – 16:00 | Jörg Jatzkowski | Fraunhofer IMWS (DE) | E-Beam Probing to attac sub 20nm nodes |
| 16:00 – 16:20 | Neel Leslie | Thermo Fisher Scientific (US) | Overcoming hardware attacks with Meridian E: a new approach for nondestructive security validation |
| 16:20 – 16:40 | Stephan Nickell | Zeiss MultiSEM GmbH (DE) | High-Throughput Imaging of Semiconductors and Electronic Components by Multi-beam SEM |